Polymer, resist composition and patterning process

Details Polymer, resist composition and patterning process Polymer, resist composition and patterning process

2006-05-25

2009-02-10

Chu, John S (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C430S330000, C430S905000, C430S910000, C526S281000, C526S284000, C526S292400

Reexamination Certificate

active

07488567

ABSTRACT:
A polymer comprising recurring units of formula (1) wherein R1is F or fluoroalkyl, R2is alkylene or fluoroalkylene, and R3is an acid labile group and having a Mw of 1,000-500,000 is used to formulate a resist composition, which is processed by the lithography involving ArF exposure and offers many advantages including resolution, minimal line edge roughness, etch resistance, and minimal surface roughness after etching. The composition performs well when processed by the ArF immersion lithography with liquid interposed between the projection lens and the wafer.

REFERENCES:
patent: 4491628 (1985-01-01), Ito et al.
patent: 5310619 (1994-05-01), Crivello et al.
patent: 6200725 (2001-03-01), Takechi et al.
patent: 6280898 (2001-08-01), Hasegawa et al.
patent: 6692884 (2004-02-01), Fujimori et al.
patent: 7105275 (2006-09-01), Sato
patent: 7291441 (2007-11-01), Sato
patent: 2001/0026901 (2001-10-01), Maeda et al.
patent: 2007/0160929 (2007-07-01), Hasegawa et al.
patent: 63-27829 (1988-02-01), None
patent: 2-27660 (1990-06-01), None
patent: 9-73173 (1997-03-01), None
patent: 9-90637 (1997-04-01), None
patent: 9-230595 (1997-09-01), None
patent: 10-10739 (1998-01-01), None
patent: 2000-26446 (2000-01-01), None
patent: 2000-159758 (2000-06-01), None
patent: WO-97/33198 (1997-09-01), None
Kishimura et al., Proceedings of SPIE, vol. 5376, 2004, p. 44.
Owa et al., Proceedings of SPIE, vol. 5040, 2003, p. 724.
Azuma et al., Proceedings of SPIE, vol. 3999, 2000, p. 264.
Hatakeyama et al., Proceedings of SPIE, vol. 5039, 2003, p. 672.
Ito et al., Proceedings of SPIE, vol. 4345, 2001, p. 273.

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