Semiconductor device with a wiring substrate and method for...

Details Semiconductor device with a wiring substrate and method for... Semiconductor device with a wiring substrate and method for...

2006-11-06

2009-06-09

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S686000, C257S737000, C257S738000, C257S778000, C257SE21705, C257SE25023

Reexamination Certificate

active

07545047

ABSTRACT:
A semiconductor device with a wiring substrate as a stacking element for a semiconductor device stack is described herein. The wiring substrate includes a plastic frame of a first plastic compound and a central region of a second plastic compound. A semiconductor chip is embedded with its back side and its edge sides in the second plastic compound, the active upper side of the semiconductor device being in a coplanar area with the first and second plastic compounds.

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