Semiconductor chip and method of manufacturing semiconductor...

Details Semiconductor chip and method of manufacturing semiconductor... Semiconductor chip and method of manufacturing semiconductor...

2008-02-11

2009-08-18

Mandala, Victor A (Department: 2826)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S667000, C438S637000, C438S613000, C438S109000, C257S737000, C257SE21585

Reexamination Certificate

active

07576004

ABSTRACT:
A semiconductor chip includes a semiconductor substrate having a first principal surface, and having a device layer on the first principal surface in which a semiconductor device is formed, an electrode pad disposed on the first principal surface of the semiconductor substrate and electrically connected to the semiconductor device, a through via formed in a through hole penetrating through the semiconductor substrate and the electrode pad, and an Au bump deposited on the electrode pad and the through via such as to electrically connect between the electrode pad and the through via.

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European Search Report dated Jul. 21, 2008; Application No./Patent No. 06255217.9- 1528 / 1777742.

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