Methods of forming semiconductor package

Details Methods of forming semiconductor package Methods of forming semiconductor package

2006-03-06

2009-02-24

Toledo, Fernando L (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C378S199000, C977S742000

Reexamination Certificate

active

07494910

ABSTRACT:
The invention includes semiconductor packages having grooves within a semiconductor die backside; and includes semiconductor packages utilizing carbon nanostructures (such as, for example, carbon nanotubes) as thermally conductive interface materials. The invention also includes methods of cooling a semiconductor die in which coolant is forced through grooves in a backside of the die, and includes methods of making semiconductor packages.

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