Soft mold, method of manufacturing the same, and patterning...

Details Soft mold, method of manufacturing the same, and patterning... Soft mold, method of manufacturing the same, and patterning...

2006-05-26

2009-11-17

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C264S219000, C430S302000, C430S322000, C430S324000, C257SE23124

Reexamination Certificate

active

07618903

ABSTRACT:
The patterning method includes forming a synthetic resin layer on a substrate, providing a mold in which a predetermined pattern is formed and metal particles are distributed on the surface of the mold, contacting the mold having the predetermined pattern with the synthetic resin layer, transferring the pattern of the mold onto the synthetic resin layer to form a patterned synthetic resin layer, and forming an organic layer on the patterned synthetic resin layer.

REFERENCES:
patent: 2003/0044727 (2003-03-01), Park et al.
patent: 2005/0206048 (2005-09-01), Ryu et al.
patent: 03-038314 (1991-02-01), None
patent: 2002-270541 (2002-09-01), None
patent: 2004-299153 (2004-10-01), None

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