Electronic assembly with hot spot cooling

Details Electronic assembly with hot spot cooling Electronic assembly with hot spot cooling

2006-11-10

2009-02-10

Purvis, Sue A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000, C257S707000, C257S710000, C257SE23051

Reexamination Certificate

active

07489033

ABSTRACT:
A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

REFERENCES:
patent: 6706562 (2004-03-01), Mahajan et al.
patent: 7328508 (2008-02-01), Edwards et al.

Affiliated with

Also associated with

Rating

Electronic assembly with hot spot cooling does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic assembly with hot spot cooling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic assembly with hot spot cooling will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4061765