4. Metal fusion bonding
  5. Process
  6. Plural joints

Youzhi E. Xu

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Electronic assembly with hot spot cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat transfer through covalent bonding of thermal interface...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Uniting two separate solid materials
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Underfill formulation and method of increasing an adhesion...

Metal fusion bonding – Process – Plural joints
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Profile ID: LFUS-PAI-P-2279412

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