Method of fabricating a BGA package having decreased adhesion

Details Method of fabricating a BGA package having decreased adhesion Method of fabricating a BGA package having decreased adhesion

2006-12-05

2009-11-10

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S178000, C257S188000, C257S459000, C257S669000, C257S688000

Reexamination Certificate

active

07615477

ABSTRACT:
Ball Grid Array packages having decreased adhesion of the BGA pad to the laminate surface and methods for producing same are provided.

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