High-accuracy pattern shape evaluating method and apparatus

Optics: measuring and testing – Shape or surface configuration – Triangulation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C356S600000, C356S601000, C250S492300, C250S300000, C382S199000

Reexamination Certificate

active

07619751

ABSTRACT:
A quantity (or dispersion value) of a distribution of edge position due to random noise is expected to be reduced statistically to 1/N when N edge position data items are averaged. Using this property, the single page image is averaged in a vertical direction with various values of parameter S, and then the edge roughness index is calculated. The S-dependence of the edge roughness index is analyzed and a term of a dispersion value directly proportional to 1/S is determined as being due to noise.

REFERENCES:
patent: 5585211 (1996-12-01), Firstein et al.
patent: 5805728 (1998-09-01), Munesada et al.
patent: 5896188 (1999-04-01), McCullough
patent: 5969357 (1999-10-01), Todokoro et al.
patent: 6411377 (2002-06-01), Noguchi et al.
patent: 6473162 (2002-10-01), Masaki et al.
patent: 6516528 (2003-02-01), Choo et al.
patent: 6781688 (2004-08-01), Kren et al.
patent: 6839470 (2005-01-01), Ikeda
patent: 6909791 (2005-06-01), Nikitin et al.
patent: 6929892 (2005-08-01), Shishido et al.
patent: 7049589 (2006-05-01), Yamaguchi et al.
patent: 7095884 (2006-08-01), Yamaguchi et al.
patent: 7133549 (2006-11-01), Eran et al.
patent: 7164127 (2007-01-01), Nakagaki et al.
patent: 7269287 (2007-09-01), Shishido et al.
patent: 2002/0097913 (2002-07-01), Ikeda
patent: 2003/0021463 (2003-01-01), Yamaguchi et al.
patent: 2005/0275850 (2005-12-01), Bischoff et al.
Yamaguchi, A. et al., Metrology of LER: Influence of Line-Edge Roughness (LER) on Transistor Performance, Proceedings of SPIE Reprint, 2004, pp. 468-476, vol. 5375, (SPIE, Bellingham, WA).
Bunday, Benjamin D., Determination of Optimal Parameters for CD-SEM Measurement of Line Edge Roughness, Proceedings of SPIE Reprint, 2004, vol. 5375 (SPIE, Bellingham, WA).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High-accuracy pattern shape evaluating method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-accuracy pattern shape evaluating method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-accuracy pattern shape evaluating method and apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4059072

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.