Semiconductor component and method for contracting said...

Details Semiconductor component and method for contracting said... Semiconductor component and method for contracting said...

2006-11-27

2008-12-09

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S666000, C257SE23024

Reexamination Certificate

active

07462557

ABSTRACT:
The semiconductor component has several regularly arranged active cells (1), each comprising at least one main defining line (8). A bonding wire (18, 20) is fixed to at least one bonding surface (14, 16) by bonding with a bonding tool, oscillating in a main oscillation direction (22, 24), for external electrical contacting. The bonding surfaces (14, 16) are of such a size and oriented such that the main oscillation direction (22, 24) runs at an angle (α), with a difference of 90° to the main defining line (8).

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Jens Peer Stengl et al.; Leistungs-MOS-FET-Praxis; 2. Auflage, Munchen, Pflaum, 1992.

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