Method for designing integrated circuit package and method...

Details Method for designing integrated circuit package and method... Method for designing integrated circuit package and method...

2006-01-11

2008-11-25

Siek, Vuthe (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C257S728000

Reexamination Certificate

active

07458054

ABSTRACT:
A new IC package12is designed as follows. That is, a circuit block2is omitted from an existing IC package11including a package11ahaving a circuit block1and the circuit block2which are connected to a plurality of terminals including high-frequency terminals, but the position of a high-frequency terminal connected to the circuit block1is never changed. Carried out next is omission of a portion6, which is associated with the circuit block2, of the package11a. This makes it possible to provide (i) a method for designing a small IC package, and (ii) a method for manufacturing the IC package. With the methods, time required for the designing and adjustment of the designing can be shortened.

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