Semiconductor device and manufacturing method thereof,...

Details Semiconductor device and manufacturing method thereof,... Semiconductor device and manufacturing method thereof,...

2005-04-21

2008-11-11

Sarkar, Asok K (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21577

Reexamination Certificate

active

07449411

ABSTRACT:
A method of manufacturing a semiconductor device includes forming a plurality of conductive layers above a substrate; forming a plurality of interlayer insulating layers; forming with dry etching a first hole penetrating the upper interlayer insulating layer to reach the lower insulating layer; forming a protective film on the first hole; and forming by etching a second hole penetrating the lower interlayer insulating layer via the first hole having the protective film formed thereon to form a contact hole.

REFERENCES:
patent: 5362666 (1994-11-01), Dennison
patent: 6368957 (2002-04-01), Horio
patent: 6586794 (2003-07-01), Nakamura et al.
patent: 6909054 (2005-06-01), Sakamoto et al.
patent: 7122463 (2006-10-01), Ohuchi
patent: 2003/0049920 (2003-03-01), Koyama
patent: 2004/0053451 (2004-03-01), Ono et al.
patent: 2004/0259328 (2004-12-01), Ito et al.
patent: A-63-003418 (1988-01-01), None
patent: A-09-063989 (1997-03-01), None
patent: A-2001-358212 (2001-12-01), None
patent: A 2002-108244 (2002-04-01), None
patent: A 2002-353245 (2002-12-01), None
patent: A-2003-086673 (2003-03-01), None
patent: A-2004-335526 (2004-11-01), None
patent: 2001-95222 (2001-11-01), None
patent: 2003-7438 (2003-01-01), None
Quirk, Michael and Julian Serda, Semiconductor Manufacturing Technology, 2001, Prentice Hall, p. 202, 261, 340.

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