Wafer curvature estimation, monitoring, and compensation

Details Wafer curvature estimation, monitoring, and compensation Wafer curvature estimation, monitoring, and compensation

2005-03-30

2008-11-18

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Introduction of conductivity modifying dopant into...

Ion implantation of dopant into semiconductor region

C257SE21324

Reexamination Certificate

active

07452793

ABSTRACT:
A method of determining wafer curvature in real-time is presented. The method includes establishing a first temperature profile for a hotplate surface, where the hotplate surface is divided into a plurality of temperature control zones. The method further includes positioning a wafer at a first height above the hotplate surface and determining a second temperature profile for the hotplate surface. The wafer curvature is then determined by using the second temperature profile. Also, a dynamic model of a processing system is presented and wafer curvature can be incorporated into the dynamic model.

REFERENCES:
patent: 5871805 (1999-02-01), Lemelson
patent: 5872694 (1999-02-01), Hoinkis et al.
patent: 5969639 (1999-10-01), Lauf et al.
patent: 6191394 (2001-02-01), Shirakawa et al.
patent: 6229116 (2001-05-01), Shirakawa et al.
patent: 6344232 (2002-02-01), Jones et al.
patent: 6478875 (2002-11-01), Sampath et al.
patent: 2003/0183613 (2003-10-01), Takano
patent: 2004/0084774 (2004-05-01), Li et al.
patent: 2005/0217799 (2005-10-01), O'Meara et al.
patent: WO2005067006 (2005-07-01), None
patent: WO2005076075 (2005-08-01), None
European Patent Office, Search Report and Written Opinion for corresponding PCT Application No. PCT/US2006/009019, Jun. 30, 2006, 8 pp.

Affiliated with

Also associated with

Rating

Wafer curvature estimation, monitoring, and compensation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer curvature estimation, monitoring, and compensation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer curvature estimation, monitoring, and compensation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4039990