Semiconductor device manufacturing: process – Chemical etching
Reexamination Certificate
2006-07-14
2008-11-18
Norton, Nadine (Department: 1792)
Semiconductor device manufacturing: process
Chemical etching
C438S692000, C438S702000, C438S707000, C216S088000, C216S089000, C257S076000, C257S103000, C156S345120
Reexamination Certificate
active
07452814
ABSTRACT:
In a polishing method of a GaN substrate according to this invention, first, while supplying a polishing solution27containing abrasives23and a lubricant25,onto a platen101,the GaN substrate is polished using the platen101and the polishing solution27(first polishing step). Then the GaN substrate is polished using the platen101in which abrasives29are buried, while supplying a lubricant31onto the platen101in which the abrasives29are buried (second polishing step).
REFERENCES:
patent: 5743788 (1998-04-01), Vanell
patent: 6136138 (2000-10-01), Yagisawa
patent: 2002/0031979 (2002-03-01), Sakurada et al.
patent: 2004/0221799 (2004-11-01), Nakayama et a.
patent: 2005/0029539 (2005-02-01), Toda et al.
patent: 2005/0145879 (2005-07-01), Nakayama et al.
patent: 1312545 (2001-09-01), None
patent: 62-102970 (1987-05-01), None
patent: 2001-205556 (2001-07-01), None
patent: 2001-322899 (2001-11-01), None
patent: 2001-355899 (2001-12-01), None
patent: 2002-64099 (2002-02-01), None
patent: 2003-305638 (2003-10-01), None
patent: 2004-58220 (2004-02-01), None
patent: 2004-281865 (2004-10-01), None
patent: 2004-331686 (2004-11-01), None
patent: 2004-335646 (2004-11-01), None
patent: 2004-356609 (2004-12-01), None
D.A. Stocker, Applied Physics Letters, vol. 73, pp. 2654-2656, (1998).
English Translation of International Search Report issued in corresponding International Application No. PCT/JP2005/024057.
Chinese Office Action, with English translation, issued in Chinese Patent Application No. CN 200580001707.3, mailed Oct. 26, 2007.
English Translation of the International Preliminary Report on Patentability, issued in corresponding International Patent Application No. PCT/JP2005/024057, dated on Jul. 26, 2007.
Korean Notice of Allowance issued in Patent Application No. KR 10-2006-7012231 dated on Jul. 31, 2008.
Chinese Office Action, with English trnaslation, issued in Chinese Patent Application No. CN 200580001707.3, mailed Oct. 26, 2007.
Angadi Maki
McDermott Will & Emery LLP
Norton Nadine
Sumitomo Electric Industries Ltd.
LandOfFree
Method of polishing GaN substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of polishing GaN substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of polishing GaN substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4038608