Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2006-12-19
2008-11-11
Le, Thao X. (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S052000, C438S050000, C257S419000, C381S191000, C381S174000
Reexamination Certificate
active
07449356
ABSTRACT:
A method of forming a microphone forms a backplate, and a flexible diaphragm on at least a portion of a wet etch removable sacrificial layer. The method adds a wet etch resistant material, where a portion of the wet etch resistant material is positioned between the diaphragm and the backplate to support the diaphragm. Some of the wet etch resistant material is not positioned between the diaphragm and backplate. The method then removes the sacrificial material before removing any of the wet etch resistant material added during the prior noted act of adding. The wet etch resistant material then is removed substantially in its entirety after removing at least part of the sacrificial material.
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Phone-Or/Technology, online <file://C:\Documents%20and%20Settings\bmansfield\Lo
Analog Devices Inc.
Bromberg & Sunstein LLP
Crawford Latanya
Le Thao X.
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