Semi-conductor device with inductive component and method of...

Details Semi-conductor device with inductive component and method of... Semi-conductor device with inductive component and method of...

2007-03-08

2008-11-18

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

07452796

ABSTRACT:
An integrated circuit (10) includes a semiconductor substrate (11) that has a top surface (32) for forming a dielectric region (14) with a trench (40) and one or more adjacent cavities (16). A conductive material such as copper is disposed within the trench to produce an inductor (50). A top surface (49) of the inductor is substantially coplanar with an interconnect surface (31) of the semiconductor substrate, which facilitates connecting to the inductor with standard integrated circuit metallization (57).

REFERENCES:
patent: 6486529 (2002-11-01), Chi et al.
patent: 7202152 (2007-04-01), Davies

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