Integrated ball and via package and formation process

Details Integrated ball and via package and formation process Integrated ball and via package and formation process

2005-05-05

2008-10-28

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S668000, C257S773000, C257S774000, C257SE23174

Reexamination Certificate

active

07442641

ABSTRACT:
A method of processing a semiconductor device is provided. The method includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a second surface of the carrier structure. The method also includes extending a conductor through one of the vias such that a first end of the conductor at least partially extends below the second surface. The method also includes electrically coupling another portion of the conductor to a portion of the semiconductor device.

REFERENCES:
patent: 6291898 (2001-09-01), Yeh et al.
patent: 6414380 (2002-07-01), Ino
patent: 2002/0027265 (2002-03-01), Yoneda et al.
patent: 2004/0025332 (2004-02-01), Haberer et al.
patent: 02-112264 (1990-04-01), None
patent: WO 03/067940 (2003-08-01), None

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