Plasma processing apparatus and plasma processing method

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – Having glow discharge electrode gas energizing means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C118S7230ER

Reexamination Certificate

active

07438783

ABSTRACT:
Disclosed is a plasma processing apparatus and a plasma processing method. A substrate to be processed is accommodated in a vacuum chamber within which a plasma generator is provided so as to generate plasma for use in performing plasma processing on the substrate. Outside the vacuum chamber provided is a magnetic field generator for generating a multi-pole magnetic field at the periphery of the substrate. The magnetic field generator comprises an inner ring-shaped magnetic field generating portion and an outer ring-shaped magnetic field generating portion, both of which are provided outside the vacuum chamber in a concentric relationship with the vacuum chamber and are independently rotatable with each other.

REFERENCES:
patent: 5429070 (1995-07-01), Campbell et al.
patent: 5444207 (1995-08-01), Sekine et al.
patent: 6014943 (2000-01-01), Arami et al.
patent: 6514377 (2003-02-01), Morimoto
patent: 2004/0238125 (2004-12-01), Ono et al.
patent: 2005/0039854 (2005-02-01), Matsuyama et al.
patent: 2005/0211383 (2005-09-01), Miyata et al.
patent: 04280430 (1992-10-01), None
patent: 06181187 (1994-06-01), None
patent: 2000-306845 (2000-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Plasma processing apparatus and plasma processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plasma processing apparatus and plasma processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma processing apparatus and plasma processing method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4016996

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.