Integrated circuit package system including ribbon bond...

Details Integrated circuit package system including ribbon bond... Integrated circuit package system including ribbon bond...

2005-11-09

2008-10-28

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S688000, C257S698000, C257S784000, C257S786000

Reexamination Certificate

active

07443018

ABSTRACT:
An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.

REFERENCES:
patent: 4666547 (1987-05-01), Snowden et al.
patent: 5110034 (1992-05-01), Simmonds
patent: 5311058 (1994-05-01), Smolley
patent: 5650914 (1997-07-01), DiStefano et al.
patent: 5767567 (1998-06-01), Hu et al.
patent: 5936492 (1999-08-01), Shingyoji et al.
patent: 6410983 (2002-06-01), Moriizumi et al.
patent: 6593622 (2003-07-01), Kinzer et al.
patent: 6967494 (2005-11-01), Kline
patent: 7348550 (2008-03-01), Sherrer et al.
patent: 2005/0224924 (2005-10-01), Koh et al.
patent: 2005/0269694 (2005-12-01), Luechinger
patent: 2006/0055011 (2006-03-01), Carney et al.

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