Carrier with reinforced leads that are to be connected to a...

Details Carrier with reinforced leads that are to be connected to a... Carrier with reinforced leads that are to be connected to a...

2002-05-07

2008-08-05

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S667000, C257S668000, C257S669000, C257S670000, C257S671000, C257S672000, C257S673000, C257S674000, C257S675000, C257S676000, C257S677000, C257S790000, C438S111000

Reexamination Certificate

active

07408242

ABSTRACT:
This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a base having a device hole and a plurality of leads for bonding a chip, the leads are provided with thin heat-resistant films.

REFERENCES:
patent: 5258331 (1993-11-01), Masumoto et al.
patent: 5276351 (1994-01-01), Yamazaki et al.
patent: 5294827 (1994-03-01), McShane
patent: 5334858 (1994-08-01), Wada
patent: 5528078 (1996-06-01), Shin
patent: 5659198 (1997-08-01), Okutomo et al.
patent: 5744859 (1998-04-01), Ouchida
patent: 5880520 (1999-03-01), Ma
patent: 5943557 (1999-08-01), Moden
patent: 6036173 (2000-03-01), Neu et al.
patent: 6043108 (2000-03-01), Izumi et al.
patent: 6063650 (2000-05-01), King et al.
patent: 6066515 (2000-05-01), Schoenfeld
patent: 6104091 (2000-08-01), Ito et al.
patent: 6258629 (2001-07-01), Niones et al.
patent: 6297964 (2001-10-01), Hashimoto
patent: 6342729 (2002-01-01), Takenaka et al.
patent: 6380620 (2002-04-01), Suminoe et al.
patent: 6410977 (2002-06-01), Hashimoto
patent: 6570099 (2003-05-01), Hirano et al.
patent: 6696747 (2004-02-01), Lee et al.
patent: 6744120 (2004-06-01), Yanagisawa
patent: 7169643 (2007-01-01), Hashimoto
patent: 2001/0002724 (2001-06-01), Miyazaki et al.
patent: 2002/0149027 (2002-10-01), Takahashi et al.
patent: 2002/0180010 (2002-12-01), Tsubosaki et al.
patent: 2003/0127713 (2003-07-01), Schoenfeld
patent: 64-13127 (1989-01-01), None
patent: 01205544 (1989-08-01), None
patent: 402022850 (1990-01-01), None
patent: 02-121344 (1990-05-01), None
patent: 03173459 (1991-07-01), None
patent: 04-291737 (1992-10-01), None
patent: 05-082593 (1993-04-01), None
patent: 5-102253 (1993-04-01), None
patent: 06-252215 (1994-09-01), None
patent: 06-342969 (1994-12-01), None
patent: 09-64092 (1997-03-01), None
patent: 11-214435 (1999-08-01), None
patent: 11-214453 (1999-08-01), None
patent: 2000-031212 (2000-01-01), None

Affiliated with

Also associated with

Rating

Carrier with reinforced leads that are to be connected to a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Carrier with reinforced leads that are to be connected to a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier with reinforced leads that are to be connected to a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4006520