Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2005-12-23
2008-10-28
Smoot, Stephen W (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
C257S781000, C257S784000, C257SE23020, C257SE23169
Reexamination Certificate
active
07443039
ABSTRACT:
An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.
REFERENCES:
patent: 6204074 (2001-03-01), Bertolet et al.
patent: 6749760 (2004-06-01), Danielson et al.
patent: 6762117 (2004-07-01), Lam et al.
patent: 7081404 (2006-07-01), Jan et al.
patent: 2003/0057559 (2003-03-01), Mis et al.
patent: 2003/0134450 (2003-07-01), Lee
Aung Kyaw Oo
Jin Yonggang
Looi Wan Lay
Shin Won Sun
Song Jae-Yong
Ishimaru Mikio
Smoot Stephen W
ST Assembly Test Services Ltd.
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