Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2007-01-05
2008-08-19
Menz, Douglas M (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S787000
Reexamination Certificate
active
07414304
ABSTRACT:
A semiconductor device including a substrate having a main surface including a first area, a second area surrounding the first area, and a third area surrounding the second area; a first insulating protective film that is provided in the first area and formed in a shape having no angles; a second insulating protective film provided in the third area; a semiconductor chip that is provided on the first insulating protective film and has a bottom surface facing to the first insulating protective film; and a sealing resin covering the semiconductor chip, wherein the bottom surface of the semiconductor chip covers the first area.
REFERENCES:
patent: 6552421 (2003-04-01), Kishimoto et al.
patent: 11-163201 (1999-08-01), None
patent: 2000-133742 (2000-05-01), None
patent: 2001-217261 (2001-08-01), None
patent: 2002-057245 (2002-02-01), None
Notice of Reason for Rejection dated Oct. 25, 2005.
Official Notice of Reason for Rejection dated Aug. 1, 2006.
Menz Douglas M
Oki Electric Industry Co. Ltd.
Studebaker Donald R.
Studebaker & Brackett PC
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