Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2006-04-21
2008-08-12
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
Plural joints
C228S248100, C228S256000
Reexamination Certificate
active
07410090
ABSTRACT:
A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.
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Cordes Steven A.
Gruber Peter A.
Knickerbocker John U.
Speidell James L.
Fleit Gibbons Gutman Bongini & Bianco P.L
Gutman Jose
International Business Machines - Corporation
Jordan Kevin M.
Stoner Kiley
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