Thermal monitoring and response apparatus and method for...

Details Thermal monitoring and response apparatus and method for... Thermal monitoring and response apparatus and method for...

2005-05-23

2008-05-06

Duncan, Marc (Department: 2113)

Error detection/correction and fault detection/recovery

Data processing system error or fault handling

Reliability and availability

C702S132000, C700S300000

Reexamination Certificate

active

07370242

ABSTRACT:
Thermal conditions within a computer unit are monitored. A system-level temperature sensor responds to intake cooling air. A subsystem-level temperature sensor responds to the temperature of a subsystem-level component, preferably a motherboard or a backplane. When the temperature sensed by of the system-level temperature sensor falls outside of a critical limit, it is determined whether the temperature sensed by the subsystem-level temperature sensor generally correlates with the temperature sensed by the system-level temperature sensor. If there is no correlation, the operation of the computer unit is continued.

REFERENCES:
patent: 5333676 (1994-08-01), Mizuno
patent: 6101459 (2000-08-01), Tavallaci et al.
patent: 6134667 (2000-10-01), Suzuki et al.
patent: 6487463 (2002-11-01), Stepp, III
patent: 6647321 (2003-11-01), Nagashima et al.
patent: 6654894 (2003-11-01), Kaminski et al.
patent: 6702665 (2004-03-01), Tai
patent: 6727824 (2004-04-01), Miseli et al.
patent: 6927961 (2005-08-01), Schestak
patent: 7290721 (2007-11-01), Cheng
patent: 2003/0135767 (2003-07-01), Chu et al.
patent: 2003/0216882 (2003-11-01), Lai et al.
patent: 2005/0216221 (2005-09-01), Broyles et al.
patent: 2006/0010353 (2006-01-01), Haugh
patent: 2007/0150225 (2007-06-01), Boerstler et al.
patent: 19531706 (1997-03-01), None
PCT/US2006/019415, PCT International Search Report, dated Oct. 11, 2006.
Written Opinion of the International Searching Authority, dated Oct. 11, 2006.
J. Steele, “ACPI Thermal Sensing and Control in the PC”, Wescon Conference, IEEE Center, Hoes Lane, US, pp. 169-182, Sep. 15, 1998.

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