Semiconductor substrate

Details Semiconductor substrate Semiconductor substrate

2006-06-06

2008-09-23

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S782000, C257S787000, C257SE21502, C257SE21129

Reexamination Certificate

active

07427811

ABSTRACT:
A semiconductor wafer having a high degree of thinness and exhibiting an enhanced strength state. A layer of tenacious reinforcement material is disposed over a back side of the wafer while in a rough state from backgrinding without prior, conventional polishing or plasma etching of the back side. The thin layer or film of reinforcement material fills grooves, fractures and scratches in the back side of the wafer, enhances the rigidity of the wafer and provides a planar, smooth, back side surface layer. The reinforcement material counteracts internal stresses of the wafer tending to warp, crack and propagate lattice defects in the wafer. The reinforcement material may also be configured to act as a die attach adhesive, may provide an ionic barrier, and may remain as part of the packaging for semiconductor dice singulated from the wafer.

REFERENCES:
patent: 5164815 (1992-11-01), Lim
patent: 5313102 (1994-05-01), Lim et al.
patent: 5476566 (1995-12-01), Cavasin
patent: 5583372 (1996-12-01), King et al.
patent: 6023094 (2000-02-01), Kao et al.
patent: 6027659 (2000-02-01), Billett
patent: 6175162 (2001-01-01), Kao et al.
patent: 6184064 (2001-02-01), Jiang et al.
patent: 6235387 (2001-05-01), Bennett et al.
patent: 6245677 (2001-06-01), Haq
patent: 6258198 (2001-07-01), Saito et al.
patent: 6279976 (2001-08-01), Ball
patent: 6291270 (2001-09-01), Saito
patent: 6338974 (2002-01-01), Stmad
patent: 6350664 (2002-02-01), Haji et al.
patent: 6403449 (2002-06-01), Ball
patent: 6472750 (2002-10-01), Sonego et al.
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6534419 (2003-03-01), Ong
patent: 6562658 (2003-05-01), Ohuchi et al.
patent: 6624078 (2003-09-01), Ravkin
patent: 6727184 (2004-04-01), Wang et al.
patent: 6797544 (2004-09-01), Sakai et al.
patent: 2002/0072308 (2002-06-01), Kane et al.
patent: 2003/0096507 (2003-05-01), Baker et al.
patent: 2004/0029041 (2004-02-01), Shih et al.
patent: 2004/0053445 (2004-03-01), Briar et al.
patent: 2004/0110010 (2004-06-01), Butchwalter et al.
patent: 359104523 (1984-06-01), None
Wolf et al. “Silicon Processing for the VLSI Era”, vol. 1: Process Technology, Lattice Press, 1986, pp. 238-239.

Affiliated with

Also associated with

Rating

Semiconductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3978501