Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-09-08
2008-03-04
Dinh, Tuan T. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S764000, C361S765000, C361S306300
Reexamination Certificate
active
07339798
ABSTRACT:
To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the die and a substrate. In an embodiment, the interposer is a multilayer ceramic structure that couples power and signal conductors on the die to corresponding conductors on the substrate. The capacitor is formed of at least one high permittivity layer and in an embodiment comprises several high permittivity layers interleaved with conductive layers. Alternatively, the capacitor can comprise at least one embedded discrete capacitor. Also described are an electronic system, a data processing system, and various methods of manufacture.
REFERENCES:
patent: 4567542 (1986-01-01), Shimada et al.
patent: 4926241 (1990-05-01), Carey
patent: 5027253 (1991-06-01), Lauffer et al.
patent: 5060116 (1991-10-01), Grobman et al.
patent: 5177594 (1993-01-01), Chance et al.
patent: 5177670 (1993-01-01), Shinohara et al.
patent: 5271150 (1993-12-01), Inasaka
patent: 5281151 (1994-01-01), Arima et al.
patent: 5321583 (1994-06-01), McMahon
patent: 5354955 (1994-10-01), Gregor et al.
patent: 5377139 (1994-12-01), Lage et al.
patent: 5469324 (1995-11-01), Henderson et al.
patent: 5488542 (1996-01-01), Ito
patent: 5639989 (1997-06-01), Higgins, III
patent: 5691568 (1997-11-01), Chou et al.
patent: 5714801 (1998-02-01), Yano et al.
patent: 5736448 (1998-04-01), Saia et al.
patent: 5745335 (1998-04-01), Watt
patent: 5777345 (1998-07-01), Loder et al.
patent: 5786630 (1998-07-01), Bhansali et al.
patent: 5796587 (1998-08-01), Lauffer et al.
patent: 5818699 (1998-10-01), Fukuoka
patent: 5840382 (1998-11-01), Nishide et al.
patent: 5867148 (1999-02-01), Kamimaki et al.
patent: 5870274 (1999-02-01), Lucas
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 5889652 (1999-03-01), Turturro
patent: 5920120 (1999-07-01), Webb et al.
patent: 5929510 (1999-07-01), Geller et al.
patent: 5939782 (1999-08-01), Malladi
patent: 5949654 (1999-09-01), Fukuoka
patent: 5991161 (1999-11-01), Samaras et al.
patent: 6061228 (2000-05-01), Palmer et al.
patent: 6072690 (2000-06-01), Farooq et al.
patent: 6075427 (2000-06-01), Tai et al.
patent: 6088915 (2000-07-01), Turturro
patent: 6097609 (2000-08-01), Kabadi
patent: 6097611 (2000-08-01), Samaras et al.
patent: 6104599 (2000-08-01), Ahiko et al.
patent: 6183669 (2001-02-01), Kubota et al.
patent: 6214445 (2001-04-01), Kanbe et al.
patent: 6218729 (2001-04-01), Zavrel, Jr. et al.
patent: 6252761 (2001-06-01), Branchevsky
patent: 6369443 (2002-04-01), Baba
patent: 6407929 (2002-06-01), Hale et al.
patent: 6446317 (2002-09-01), Figueroa et al.
patent: 6452776 (2002-09-01), Chakravorty
patent: 6532143 (2003-03-01), Figueroa et al.
patent: 6611419 (2003-08-01), Chakravorty
patent: 6755150 (2004-06-01), Lai et al.
patent: 6970362 (2005-11-01), Chakravorty
patent: 7120031 (2006-10-01), Chakravorty et al.
patent: 0359513 (1990-03-01), None
patent: 0656658 (1995-06-01), None
patent: 07-142867 (1995-06-01), None
patent: 08-172274 (1996-07-01), None
patent: 10-163447 (1998-06-01), None
patent: WO-97/50123 (1997-12-01), None
patent: WO-98/39784 (1998-09-01), None
patent: WO 00/21133 (2000-04-01), None
patent: WO-01/00573 (2001-01-01), None
patent: WO-0211206 (2002-02-01), None
Amey, D.I. , et al., “Advances in MCM Ceramics”,Solid State Technology, (1997), 143-146.
Baniecki, J.D. , et al., “Dielectric Relaxation of Ba0.7 Sr0.3 TiO3 Thin Films from 1 mHz to 20 GHz”,Appl. Phys. Letter 72(4), 1998 American Institue of Physics,(Jan. 1998), 198-500.
Chan, Y.C. , et al., “Fabrication and Characterization of Multilayer Capacitors Buried in a Low Temperature Co-Fired Ceramic Substrate”,Active and Passive Elec. Comp.vol. 20, (1998), 215-224.
Choi, Kwang L., et al., “Characterization of Embedded Passives Using Macromodels in LTCC Technology”,IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 21, (Aug. 1998), 258-268.
Eurskens, W. , et al., “Design and Performance of UHF Band Inductors, Capacitors and Resonators Using LTCC Technology for Mobile Communication Systems”,1998 IEEE MTT—S Digest, (1998), 1285-1288.
Koschmieder, Thomas , et al., “Ceramic Substrate Thickness, Test Board Thickness, and Part Spacing: A Screening Doe”,Proceedings of SMTA.
International Conference, (Sep. 1999),6 pgs.
Mistler, Richard E., “Tape Casting: Past, Present, Potential”,The American Ceramic Society Bulletin, (Oct. 1998),82-86.
Nishimura, T.B. , et al., “3.5 V Operation Driver-Amplifier MMIC Utilizing SrTiO3 Capacitors for 1.95 GHz Wide-Band CDMA Cellular Phones”,1998 IEEE MTT-S Digest, (1998),447-450.
Rector, Jr., John , et al., “Integrated and Integral Passive Components: A Technology Roadmap”,1997 Electronic Components and Technology Conference, (1997),713-723.
Scrantom, Steve , et al., “Manufacture of Embedded Integrated Passive Components into Low Temperature Co-Fired Ceramic Systems”,1998 International Symposium on Microelectronics, (1998),459-466.
Sugai, Kouichiro , et al., “Multilayer Alumina Substrates for ECU”,1998 IEEE/CPMT Berlin Int'l Electronics Manufacturing Technology Symposium, (1998), 109-112.
Tok, Alfred I., et al., “Tape Casting of Composite Ceramic Substrates Using Hollow Micro-Speherical Powders”,Processing and Fabrication of Advanced Materials VII, Proceedings of a Symposium organized by: The Minerals, Metals & Materials Society (TMS), Warrendale, PA, USA,(Oct. 1998),451-461.
Ueda, Tetsuzo , et al., “GaAś MMIC Chip-sets for Mobile Communication Systems with On-chip Ferroelectrics Capacitors”,Integrated Ferrelectrics, vol. 7, (1995),45-60.
Williamson, III, William , et al., “High Frequency Dielectric Properties of PLZT Thin Films”,Integrated Ferroelectrics, vol. 17, (1997),197-203.
Yamasaki, Kozo , et al., “Solder Column Interposer Grid Array—Improved CBGA Reliability”, 1-9.
Yao, Kui , et al., “Improved Preparation Procedure and Properties for a Multilayer Piezoelectric Thick-Film Actuator”,Sensors and Actuators A 71,(1998), 139-143.
Dinh Tuan T.
Guglielmi David L.
Intel Corporation
LandOfFree
Electronic assemblies and systems comprising interposer with... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic assemblies and systems comprising interposer with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic assemblies and systems comprising interposer with... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3977384