Apparatus for performing high frequency electronic package...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Reexamination Certificate

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Details

C257S693000, C257S698000, C257S728000, C257SE23179, C438S014000, C438S015000, C438S018000, C324S765010

Reexamination Certificate

active

07348597

ABSTRACT:
Various apparatus for performing high frequency electronic package testing are disclosed. A test fixture assembly includes an electronics package having an interface structure, a mock-up IC, coupled to the interface structure for providing circuit connections, and a fixture board, coupled to the interface structure, wherein at least one of the fixture board and mock-up IC includes high frequency probe pads for providing a signal and ground point for high bandwidth test probing. Raw measurements are used for validation of the electronic package specifications when adequate test fixture bandwidth is available or included into circuit simulations models when a minimal phase error is acceptable, else phase and loss corrections are applied to the measurements.

REFERENCES:
patent: 5142224 (1992-08-01), Smith et al.
patent: 5351001 (1994-09-01), Kornrumpf et al.
patent: 5614442 (1997-03-01), Tserng
patent: 5942911 (1999-08-01), Motika et al.
patent: 6215377 (2001-04-01), Douriet
patent: 2005/0216213 (2005-09-01), Sternberg et al.

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