Electronic component mounting package and package assembled...

Details Electronic component mounting package and package assembled... Electronic component mounting package and package assembled...

2008-05-27

2008-05-27

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C438S125000

Reexamination Certificate

active

11389330

ABSTRACT:
A package of the present invention has a laminate structure of a plurality of ceramic layers, and includes a cavity for housing a light emitting element. A mount surface is defined on a side surface parallel with the depth direction of the cavity. A pair of external electrodes each including a charged electrode portion and a coated electrode portion are formed over the entire length in the laminating direction at two corners defined by intersection of the mount surface and two side surfaces perpendicular to the mount surface. When the package is mounted, a pair of charged electrode portions and a pair of coated electrode portions are soldered to a surface of a substrate.

REFERENCES:
patent: 5451716 (1995-09-01), Hasegawa et al.
patent: 6372985 (2002-04-01), Shimoe
patent: 6608366 (2003-08-01), Fogelson et al.
patent: 6913950 (2005-07-01), Kobayakawa
patent: 6919624 (2005-07-01), Tani et al.
patent: 6-96992 (1994-04-01), None
patent: 2002-232017 (2002-08-01), None

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