4. Electric heating
  5. Metal heating
  6. Of cylinders

Hideki Takagi

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Electronic component mounting package and package assembled...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Electronic component mounting package and package assembled...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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IC package capable of accommodating discrete devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Method of forming film of ultrafine particles

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of coating supply or source outside of primary...
Reexamination Certificate

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Process for assembling piping or components by TIG welding

Electric heating – Metal heating – Of cylinders
Patent

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Profile ID: LFUS-PAI-P-1445774

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