Dual-bit non-volatile memory cell and method of making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S314000, C257S326000, C257S637000

Reexamination Certificate

active

11306737

ABSTRACT:
A non-volatile memory cell having a local silicon nitride layer to control dispersion of hot electrons is disclosed. The dual-bit non-volatile memory cell has a stack of layers including silicon on the surface of a substrate. The stack of layers has at least one first oxide silicon layer and a silicon nitride layer overlying the first oxide silicon layer. An opening is formed in the stack of layers and a gate oxide layer is deposited on the surface of the substrate within the opening. A control gate is formed on the gate oxide layer followed by a second oxide silicon layer overlying the surfaces of the control gate and the stack of layers. A second polysilicon layer is formed overlying the gate oxide layer. Dual split-gates are then formed on the second polysilicon layer.

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patent: 6713333 (2004-03-01), Mayuzumi
patent: 6893917 (2005-05-01), Hsieh
patent: 2003/0122185 (2003-07-01), Wang et al.
patent: 2004/0171243 (2004-09-01), Lee et al.
patent: 2005/0051836 (2005-03-01), Choi et al.
patent: 2005/0054167 (2005-03-01), Choi et al.
patent: 2005/0142758 (2005-06-01), Jung

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