Abrading – Precision device or process - or with condition responsive... – With indicating
Reexamination Certificate
2008-01-01
2008-01-01
Morgan, Eileen P. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
With indicating
C451S011000, C451S041000, C451S287000, C156S345250, C156S345280
Reexamination Certificate
active
11545928
ABSTRACT:
Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by measuring the capacitance between a first sensor associated with the workpiece holder and a second sensor associated with the abrasion member. This exemplary control system may adjust a process parameter of the planarization cycle in response to a change in the measured capacitance. This can be useful in endpointing the planarization cycle, for example. In certain applications, the control system may define a pad profile based on multiple capacitance measurements and use the pad profile to achieve better planarity of the planarized surface.
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Micro)n Technology, Inc.
Morgan Eileen P.
Perkins Coie LLP
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