Method and system of trace pull test

Details Method and system of trace pull test Method and system of trace pull test

2008-01-15

2008-01-15

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

C438S014000, C324S765010

Reexamination Certificate

active

11235485

ABSTRACT:
The present invention provides an efficient test method and system for testing the IC package, such as BGA types of packages. With the present invention, manufacturer can have an easier way in testing various types of packages, including newer types. Manufacturer also can get the testing outcome which is more accurate. Furthermore, the present invention helps the manufacturer achieve a significant improvement in an IC packaging process.

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