Method and system for sizing a load plate

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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Details

C438S125000, C257S678000, C257S704000, C257S718000

Reexamination Certificate

active

10639853

ABSTRACT:
A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is adjusted to cause the load plate to provide a target load when installed in the ASIC assembly.

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