Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-01-29
2008-01-29
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S125000, C257S678000, C257S704000, C257S718000
Reexamination Certificate
active
10639853
ABSTRACT:
A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is adjusted to cause the load plate to provide a target load when installed in the ASIC assembly.
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Hewlett--Packard Development Company, L.P.
Jr. Carl Whitehead
Mitchell James M
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