Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Patent
1995-01-13
1997-06-03
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
257660, 257699, 257708, 257710, 361816, 361818, 361820, H01L 23552, H01L 2304, H01L 23043
Patent
active
056357540
ABSTRACT:
The radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose the integrated circuit die within, wherein the lid and the base are each constructed from a high-Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high-Z material disposed between the integrated circuit die and a base, in combination with a high-Z material lid to substantially block incident radiation.
REFERENCES:
patent: 4506108 (1985-03-01), Kersch et al.
patent: 4833334 (1989-05-01), Valy et al.
patent: 4975762 (1990-12-01), Stradley et al.
patent: 5317107 (1994-05-01), Osorio
patent: 5406117 (1995-04-01), Dlugokecki et al.
Millward, D. G., et al., "The Effectiveness of Rad-Pak ICs . . . ", 1990 Proceedings 40th Electronic Components and Technology Conf., IEEE, vol. 2, pp. 913-916, 1990.
Harper, C. Electronic Packaging and Interconnection Handbook, McGraw-Hill, 1991, p. 6.34.
Czajkowski David R.
Strobel David J.
Crane Sara W.
Kleinke Bernard L.
Ostrowski David
Scott Peter P.
Space Electronics, Inc.
LandOfFree
Radiation shielding of integrated circuits and multi-chip module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Radiation shielding of integrated circuits and multi-chip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation shielding of integrated circuits and multi-chip module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-393430