Multi-pixel electron emission die-to-die inspection

Details Multi-pixel electron emission die-to-die inspection Multi-pixel electron emission die-to-die inspection

2008-04-01

2008-04-01

Berman, Jack I. (Department: 2881)

Radiant energy

Inspection of solids or liquids by charged particles

Electron probe type

C250S306000, C250S307000, C250S311000, C250S397000, C250S492200, C250S492300

Reexamination Certificate

active

11137750

ABSTRACT:
One embodiment disclosed is a method of detecting defects in objects. A selected surface area of an object is inspected with a multi-pixel electron microscope, and first set of data is generated having signal values representing image content of each pixel thereof. Further selected surface area of the object is inspected with said multi-pixel electron microscope, and second set of data is generated having signal values representing image content of each pixel thereof. Corresponding portions of first and second sets of data are stored in memory. Misalignment between stored portions of the first and second sets of data is detected with resolution of a fraction of a pixel, and the stored portions of first and second sets of data are aligned using subpixel interpolation to correct the detected misalignment therebetween. Finally, corresponding subportions of the aligned portions of first and second sets of data are compared to detect differences therebetween.

REFERENCES:
patent: 6087659 (2000-07-01), Adler et al.
patent: 6566885 (2003-05-01), Pinto et al.
patent: 6586733 (2003-07-01), Veneklasen et al.
patent: 6897444 (2005-05-01), Adler

Affiliated with

Also associated with

Rating

Multi-pixel electron emission die-to-die inspection does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-pixel electron emission die-to-die inspection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-pixel electron emission die-to-die inspection will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3933262