Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

2008-04-29

2008-04-29

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S142000, C430S022000

Reexamination Certificate

active

11209722

ABSTRACT:
A method of manufacturing a semiconductor device. The device includes a plurality of layers on a semiconductor substrate. The method includes the steps of dividing a pattern of at least one layer into a plurality of sub-patterns, and joining the divided sub-patterns to perform patterning. A layer that includes wiring substantially affects operation of the semiconductor device depending on a positional relationship to any other wiring. The patterning is performed by one-shot exposure using a single mask.

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Korean Official Letters/Search Report dated Jul. 27, 2005, issued in corresponding Korean patent application No. 10-2003-0065363.

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