Methods of and apparatus for forming conductive patterns on a su

Details Methods of and apparatus for forming conductive patterns on a su Methods of and apparatus for forming conductive patterns on a su

1985-04-03

1986-08-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 1566591, 156664, 156901, 156345, 156635, 174 685, 427 96, 428601, 428615, 428901, 430313, 430315, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

046067884

ABSTRACT:
A method of forming an electrically conductive pattern on a substrate includes the steps of forming a layer of gold on an electrically insulating substrate and coating the gold layer with a photo-resist. The resist is exposed to light through a photo mask and the exposed portions of the photo-resist are selectively removed by etching. The now exposed parts of the gold layer are coated with copper and the remaining photo-resist is removed. The exposed parts of the gold layer and the copper are subjected to molten tin which simultaneously acts to dissolve the exposed parts of the gold layer and to form an electrically conductive coating on the copper.
The process enables the formation of a precise conductive pattern with enhanced reliability.

REFERENCES:
patent: 3615465 (1971-10-01), Bullinger
patent: 3837944 (1974-09-01), Cole
patent: 3881884 (1975-05-01), Cook et al.
patent: 3883947 (1975-05-01), Kruger et al.
patent: 4357202 (1982-11-01), Rutz

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