High-density bond pad layout arrangements for semiconductor dies

Details High-density bond pad layout arrangements for semiconductor dies High-density bond pad layout arrangements for semiconductor dies

1995-04-28

1997-06-03

Nguyen, Tuan H.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

437183, 437204, 437209, 364491, 438106, H01L 2141

Patent

active

056354240

ABSTRACT:
Composite bond pad structure and geometry increases bond pad density and reduces lift-off problems. Bond pad density is increased by laying out certain non-square bond pads which are shaped, sized and oriented such that each bond pad closely conforms to the shape of the contact footprint made therewith by a bond wire or lead frame lead and aligns to the approach angle of the conductive line to which it is connected. Alternating, interleaved, complementary wedge-shaped bond pads are discussed. Bond pad liftoff is reduced by providing an upper bond pad, a lower bond pad and an insulating component between the upper and lower bond pads. At least one opening is provided through the insulating component, extending from the bottom bond pad to the upper bond pad. The at least one opening is aligned with a peripheral region of the bottom bond pad and is filled with conductive material.

REFERENCES:
patent: 5454905 (1995-10-01), Fogelson

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