Reworkable thermal interface material

Details Reworkable thermal interface material Reworkable thermal interface material

2007-08-07

2007-08-07

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S706000, C257S707000, C257SE23075

Reexamination Certificate

active

10630550

ABSTRACT:
A process of making a reworkable thermal interface material is described. The reworkable thermal interface material is bonded to a die and a heat sink. The reworkable thermal interface material includes a phase-change polymer matrix material. Other materials in the reworkable thermal interface material can include heat transfer particles and low melting-point metal particles. The phase-change polymer matrix material includes a melting temperature below a selected temperature and the heat transfer particles have a melting temperature substantially above the selected temperature. The heat transfer particles act as a spacer limit, which holds the thermal interface material to a given bond-line thickness during use.

REFERENCES:
patent: 2002/0000239 (2002-01-01), Sachdev et al.
patent: 2003/0203188 (2003-10-01), H.
patent: WO 00/36893 (2000-06-01), None

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