Image sensing chip package structure

Details Image sensing chip package structure Image sensing chip package structure

2007-10-16

2007-10-16

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S704000, C257SE31095

Reexamination Certificate

active

11225078

ABSTRACT:
In an image sensing chip package structure, plated through vias penetrate a substrate to electrically connect metallization traces disposed on the upper and lower surfaces of the substrate. The plated through vias can be opened from the center of the substrate instead of being located at the periphery of the substrate. Contamination can thus be avoided during the glue dispensing process, and protection layers can also be used to seal gaps generated by the plated through vias, hence enhancing the producing yield. Moreover, protection layers having stickiness can further be used to secure components so as to reduce the production cost and enhance the product quality.

REFERENCES:
patent: 6483030 (2002-11-01), Glenn et al.
patent: 6531784 (2003-03-01), Shim et al.
patent: 7005720 (2006-02-01), Huang et al.

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