Methods and apparatus for particle reduction in MEMS devices

Details Methods and apparatus for particle reduction in MEMS devices Methods and apparatus for particle reduction in MEMS devices

2007-11-20

2007-11-20

Pham, Long (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C438S471000, C438S025000, C438S048000, C438S058000, C438S064000

Reexamination Certificate

active

11280040

ABSTRACT:
A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.

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Gilleo, Ken, “MEMS Packaging and Assembly Issues”, SMTA International Proceedings of the Technical Program, Sep. 24, 2000, pp. 784-789, XP008020112.

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