Stacked semiconductor packages

Details Stacked semiconductor packages Stacked semiconductor packages

2007-12-18

2007-12-18

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S787000, C257SE25013, C257SE25018, C257SE25021, C257SE25027

Reexamination Certificate

active

10986510

ABSTRACT:
A stacked semiconductor package includes a substrate and a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is mounted on the interposer.

REFERENCES:
patent: 5438224 (1995-08-01), Papageorge et al.
patent: 5904497 (1999-05-01), Akram
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6437449 (2002-08-01), Foster
patent: 6441483 (2002-08-01), Akram
patent: 6577013 (2003-06-01), Glenn et al.
patent: 6603072 (2003-08-01), Foster et al.
patent: 2002/0089066 (2002-07-01), Massoodi et al.
patent: 2002/0121705 (2002-09-01), Pu et al.

Affiliated with

Also associated with

Rating

Stacked semiconductor packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked semiconductor packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked semiconductor packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3886403