Method for separating electronic component from organic board

Details Method for separating electronic component from organic board Method for separating electronic component from organic board

2007-06-26

2007-06-26

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Disassembling

C029S402030, C029S426100, C029S840000, C219S056220, C219S209000, C219S635000, C228S119000, C228S264000

Reexamination Certificate

active

10906816

ABSTRACT:
A method and electrical structure for separating electronic components from one another joined by solder interconnections. An electronic module is joined to a substrate via a solder interconnection, whereby the electronic module has an electrical heating component residing within a bottom layer thereof adjacent a solder interconnection. Preferably, a chip carrier is joined to a board whereby the chip carrier has an electrical mesh plane for heating adjacent the solder interconnection. Resistive heat is generated within this electrical heating component either by applying an electrical current to the electrical heating component, or by non-contact inductively heating the layer in which such electrical heating component resides to generate resistive heat within the electrical heating component. The resistive heat is transferred to the solder interconnection to allow for localized melting of the solder interconnection and removal of the electronic components from one another.

REFERENCES:
patent: 4582975 (1986-04-01), Daughton
patent: 4769525 (1988-09-01), Leatham
patent: 4983804 (1991-01-01), Chan et al.
patent: 5542601 (1996-08-01), Fallon et al.
patent: 5549240 (1996-08-01), Urban
patent: 5700987 (1997-12-01), Basavanhally
patent: 5746367 (1998-05-01), Pai et al.
patent: 5862588 (1999-01-01), Heim et al.
patent: 5901898 (1999-05-01), Strempke
patent: 5954978 (1999-09-01), Seelert et al.
patent: 6012624 (2000-01-01), French et al.
patent: 6031729 (2000-02-01), Berkely et al.
patent: 6068175 (2000-05-01), Heim et al.
patent: 6396706 (2002-05-01), Wohlfarth
patent: 6705006 (2004-03-01), Baechtle et al.
patent: 2002/0112883 (2002-08-01), Baechtle et al.
patent: 2002/0170901 (2002-11-01), Lau
patent: 2003/0019918 (2003-01-01), Farooq et al.
Separable Multilevel Thermal Connector, IBM Technical Disclosure Bulletin, Apr. 1978, pp. 4776-4779.
Method for Soldering/Unsoldering Heat Sensitive Parts, IBM Technical Disclosure Bulletin, Oct. 1979, pp. 1827-1829.

Affiliated with

Also associated with

Rating

Method for separating electronic component from organic board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for separating electronic component from organic board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for separating electronic component from organic board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3877791