Three dimensional integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor

Reexamination Certificate

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Details

C257SE27026, C257SE21614, C438S455000

Reexamination Certificate

active

10919121

ABSTRACT:
A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.

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Kunio et al., Three Dimensional ICs, Having Four Stacked Active Layers, IEDM 89-837, Jul. 1, 1989, pp. 34.6.1-4, Publisher: IEEE, Published in: US.

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