Method of fabricating semiconductor device employing...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S332000, C257S338000, C257S369000, C257S635000, C257S750000, C257SE29040, C257SE21199, C257SE21430

Reexamination Certificate

active

11026312

ABSTRACT:
A method for fabricating a semiconductor device employing a selectivity poly deposition is disclosed. The disclosed method comprises depositing selectivity poly on a gate poly and source/drain regions of the silicon substrate, and forming salicide regions on the gate and active regions from the deposited selectivity poly. Accordingly, the present invention employing selectivity poly deposition can reduce or minimize contact surface resistance and improve the electrical characteristics of the semiconductor device by reducing the surface resistance in a miniature semiconductor device. In addition, because the size of the gate electrode is getting small, the present invention can be used as an essential part of the future generations of nano-scale technology. Moreover, mass semiconductor production systems can promptly employ the present invention with existing equipment.

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Teru Mineji and Tomoko Yasunaga; Manufacture or Semiconductor Device; Patent Abstracts of Japan; Publication Date: Sep. 11, 1998; 2 Pages; Japen Patent Office, Japan.
Laura Peters; Selective Epitaxy Falls into Favor; Semiconductor International, Nov. 1, 2004; 4 pages; Reed Business Information, Reed Elsevier Inc.
Stanley Wolf, Ph.D., Richard N. Tauber, Ph.D.; Silicon Processing for the VLSI Era; vol. 1: Process Technology, Second Edition; Copyright 2000; Lattice Press, Sunset Beach, CA, USA.

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