Programming semiconductor dies for pin map compatibility

Details Programming semiconductor dies for pin map compatibility Programming semiconductor dies for pin map compatibility

2007-06-12

2007-06-12

Tan, Vibol (Department: 2819)

Electronic digital logic circuitry

Multifunctional or programmable

Having details of setting or programming of interconnections...

C326S041000, C326S047000

Reexamination Certificate

active

10848395

ABSTRACT:
Methods and systems provide for a semiconductor die that is compatible with a wide variety of industry standard sockets, where each type of socket is identified by a different pin map. In one embodiment, the die has a plurality of signal lines, one or more surface contacts and one or more signal selectors coupled to the signal lines and the surface contacts. Each signal selector electrically connects one of the signal lines to one of the surface contacts based on a programming signal. In a particularl embodiment, each signal selector includes a multiplexer and a fuse element, where the multiplexer routes one of its input ports to its output port based on a programming value of the fuse element. The programming value can be set by the programming signal.

REFERENCES:
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patent: 6285211 (2001-09-01), Sample et al.
patent: 6417695 (2002-07-01), Duesman
patent: 6456099 (2002-09-01), Eldridge et al.
patent: 6667895 (2003-12-01), Jang et al.
patent: 6844218 (2005-01-01), Potts
patent: 2003/0112751 (2003-06-01), Yuffe et al.
patent: 1313142 (2003-05-01), None
PCT International Search Report and Written Opinion, PCT/US2005/014882, mailed Nov. 24, 2005, 11 pages.

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