Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Reexamination Certificate
2007-06-19
2007-06-19
Meeks, Timothy (Department: 1762)
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
C156S345510, C118S728000
Reexamination Certificate
active
10408261
ABSTRACT:
Provided is a plasma processing method and apparatus and a tray for plasma processing, which are able to improve temperature controllability of a substrate. If a vacuum chamber is evacuated by a pump while introducing a specified gas by a gas supply unit into the vacuum chamber and a high-frequency power is applied by a coil use high-frequency power supply to a coil while maintaining an interior of the vacuum chamber at a specified pressure, then plasma is generated in the vacuum chamber, and a substrate placed on a substrate electrode can be subjected to plasma processing. At this time, by providing an adhesive sheet between the substrate electrode and the substrate, temperature controllability of the substrate can be improved.
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Nitta Toshinari
Okumura Tomohiro
Matsushita Electric - Industrial Co., Ltd.
Meeks Timothy
Turocy David
Wenderoth , Lind & Ponack, L.L.P.
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