Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2007-10-16
2007-10-16
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257SE23070
Reexamination Certificate
active
11325293
ABSTRACT:
A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. In addition, methods for designing and using rerouting elements are disclosed. Semiconductor device assemblies including one or more rerouting elements that provide contacts adjacent to one or two adjacent peripheral edges of a semiconductor die are also disclosed, as are semiconductor device assemblies in which contacts adjacent to two or more peripheral edges of a lower semiconductor device are exposed laterally beyond peripheral edges of an upper semiconductor device.
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Brooks Jerry M.
Corisis David J.
Reynolds Tracy V.
Schwab Matt E.
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TraskBritt PC
Zarneke David A.
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