Semiconductor integrated circuit chip packages having...

Details Semiconductor integrated circuit chip packages having... Semiconductor integrated circuit chip packages having...

Filed on

2007-06-12

Date issued

2007-06-12

Examiner

Crane, Sara (Department: 2811)

Patent Class

Active solid-state devices (e.g., transistors, solid-state diode

SubClass

Housing or package

SubSubClass

With provision for cooling the housing or its contents

Other Related Categories

C257S714000, C165S080400, C165S170000

Type

Reexamination Certificate

Status

active

Patent number

10987985

Description

ABSTRACT:
Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

REFERENCES:
patent: 4266282 (1981-05-01), Henle et al.
patent: 5031071 (1991-07-01), Seibert et al.
patent: 5031072 (1991-07-01), Malhi et al.
patent: 5199165 (1993-04-01), Crawford et al.
patent: 5309318 (1994-05-01), Beilstein, Jr. et al.
patent: 5812375 (1998-09-01), Casperson
patent: 5825087 (1998-10-01), Iruvanti et al.
patent: 6593644 (2003-07-01), Chiu et al.
patent: 2004/0156173 (2004-08-01), Jeong
patent: 2005/0151244 (2005-07-01), Chrysler et al.

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