Leadless microelectronic package and a method to maximize...

Details Leadless microelectronic package and a method to maximize... Leadless microelectronic package and a method to maximize...

2007-10-30

2007-10-30

Smith, Zandra V. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S110000, C438S111000, C438S112000, C438S113000, C438S121000, C438S124000

Reexamination Certificate

active

11123567

ABSTRACT:
Arrangements and methods of packaging integrated circuits in leadless leadframe packages configured for maximizing a die size are disclosed. The package is described having an exposed die attach pad and a plurality of exposed contacts formed from a common substrate material. The contacts, however, are thinned relative to the die attach pad. In one embodiment, an inner region of the contacts is thinned. In another embodiment, an outer region of the contacts is also thinned. A die is mounted on the die attach pad and wire bonded to the contacts. Since the inner region and sometimes together with the outer region of the contact are lower than the die attach pad being wire bonded to, the size of the die can be relatively increased to overhang over the contact, thereby maximizing the die size in the package. A plastic cap is molded over the die, contacts, and bonding wires while leaving the bottom surface of the contacts exposed.

REFERENCES:
patent: 6143981 (2000-11-01), Glenn
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6414385 (2002-07-01), Huang et al.
patent: 6424024 (2002-07-01), Shih et al.
patent: 6448633 (2002-09-01), Yee et al.
patent: 6452255 (2002-09-01), Bayan et al.
patent: 6498099 (2002-12-01), McLellan et al.
patent: 6559525 (2003-05-01), Huang
patent: 6650020 (2003-11-01), Yamada et al.
patent: 6759737 (2004-07-01), Seo et al.
patent: 2002/0031869 (2002-03-01), Minamio et al.
patent: 2002/0039808 (2002-04-01), Fukutomi et al.
patent: 2002/0041019 (2002-04-01), Gang
patent: 2002/0056856 (2002-05-01), McLellan et al.
patent: 2002/0084534 (2002-07-01), Paek
patent: 2003/0001244 (2003-01-01), Araki et al.
patent: 2003/0001252 (2003-01-01), Ku et al.
patent: 2003/0003627 (2003-01-01), Yamaguchi et al.
patent: 2003/0203539 (2003-10-01), Islam et al.
patent: 2003/0214048 (2003-11-01), Wu et al.

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